CASPA 2024 Career Fair

CASPA 2024 Career Fair

CASPA's High-Tech Career Fair. This event will be held on June 1st, 2024, at UCSC Silicon Valley Extension.

By Chinese American Semiconductor Professional Association

Date and time

Saturday, June 1 · 1:30 - 4pm PDT

Location

UCSC Silicon Valley Extension

3175 Bowers Avenue Santa Clara, CA 95054

Agenda

1:00 PM - 1:30 PM

Booth setup by exhibitors

1:30 PM - 2:00 PM

Networking

2:00 PM - 2:05 PM

Opening by CASPA President

2:05 PM - 2:20 PM

Keynote By SVP Rose Castanares TSMC

2:20 PM - 2:45 PM

Fireside with LinkedIn VP Lei Yang and CASPA BOD Jimmy Cheng

2:45 PM - 2:55 PM

GUC career from GM Jeffery Chan

2:55 PM - 3:05 PM

ASE speech from Sr Dir Patricia Macleod

3:05 PM - 3:15 PM

Intellipro speech from CEO Yisu Jin

3:15 PM - 4:30 PM

NetWorking

About this event

  • 2 hours 30 minutes

This workshop presents an excellent opportunity for our sponsors to showcase company culture, provide guidance on career development, and present career opportunities that go beyond what is typically advertised on Linkedin. It also offers sponsors a unique platform to engage with a diverse audience and make a lasting impression.

Don't miss the chance to attend this career fair and workshop and meet face-to-face with recruiter, HR and senior executives

Join Us for an Exciting Career Fair!


Are you ready to take your career to the next level?

Don't miss our upcoming Career Fair, where you can connect with industry leaders, gain valuable insights, and explore exciting job opportunities!

Event Highlights:

Fireside Chat with LinkedIn VP:

Topic: The Impact of AI on the Future of Jobs

Speaker: Lei Yang, Vice President of LinkedIn

Discussion Points:

  1. How AI is transforming various industries.
  2. Skills needed in an AI-driven job market.
  3. Strategies to navigate and plan your career in the age of AI.
  4. Q&A Session: Get your questions answered by an industry expert!


Meet Top Recruiters:

Recruiters from leading semiconductor companies will be present.

Network with potential employers and explore job openings.

Bring your resume and make a great first impression!

Organized by

 

Founded in 1991, CASPA has developed into the largest Chinese American semiconductor professional organization worldwide. It is an officially registered non-profit organization with both the Internal Revenue Service and the State of California.
CASPA charters
1. Provide networking and business expansion for corporate sponsors and individual members
2. Facilitate collaboration and communication among professionals and companies in the semiconductor industry
3. Promote the welfare of the members by supporting their interests
4. Exchange information regarding job opportunities and career development globally.
 

CASPA consists of individual members, corporate sponsors, board of directors, board of advisors, board of volunteers, and honorary advisors. The board of directors consists of 20 members including Chairman, Vice Chairman, Secretary, CFO. Every year after the annual conference, the new board select Vice Chairman from qualified candidates. The Vice Chairman becomes the Chairman in the following year to guarantee continuity of leadership of CASPA. The board of advisors consists of current year's chairman and past six year's former chairmen. In addition, there are 7 Honorary Advisors since 2000. Headquartered in Silicon Valley, California, CASPA has 11 local chapters worldwide: Albany New York, Austin & Dallas Texas; Phoenix Arizona; Portland Oregon; HsinChu Taiwan, Pearl River Delta (Hong Kong, ShenZhen), San Diego California, Shanghai, Beijing and Singapore. CASPA also forms alliance with other associations to promote welfare of its members. In 2004, CASPA reciprocates memberships with two of the largest professional organizations in the industry, SEMI and FSA.
 

Currently CASPA has more than four thousand individual members covering multiple disciplines. Most of them are semiconductor professionals working in Silicon Valley, Southern California, Oregon, Washington, Arizona, Texas, New York, China, Taiwan, and Singapore. CASPA also has more than 70 corporate sponsors, including EDA, design, IDM, foundry, packaging / test, venture capital, science and technology development parks, legal and financial service companies located in the United States, Taiwan, Hong Kong, China, Singapore and Japan.

 

1. Bi-monthly dinner meetings
2. Conferences, Seminars, Workshops and Symposiums
3. International and domestic Job Fairs
4. CASPA Delegations to China, Taiwan, and Asia Pacific countries
5. Hosting Delegations from China, Taiwan, and other Asia Pacific countries
6. Annual banquet and special summer program.
 

1. Semimonthly eLtters
2. Quarterly newsletters
3. Annual Conference Proceeding
4. Other conference and delegation proceedings

 

 

 

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