CASPA 2018 Summer Symposium - SEMI SIIP Forum: Innovation at Scale-from IoT, Could to AI and ADAS

I. Introduction of Chinese American Semiconductor Professional Association (CASPA)Founded in 1991, CASPA has developed into the largest Chinese American semiconductor professional organization worldwide. It is an officially registered non-profit organization with both the Internal Revenue Service and the State of California.CASPA charters1. Provide networking and business expansion for corporate sponsors and individual members2. Facilitate collaboration and communication among professionals and companies in the semiconductor industry3. Promote the welfare of the members by supporting their interests4. Exchange information regarding job opportunities and career development globally.II. OrganizationCASPA consists of individual members, corporate sponsors, board of directors, board of advisors, board of volunteers, and honorary advisors. The board of directors consists of 20 members including Chairman, Vice Chairman, Secretary, CFO. Every year after the annual conference, the new board select Vice Chairman from qualified candidates. The Vice Chairman becomes the Chairman in the following year to guarantee continuity of leadership of CASPA. The board of advisors consists of current year's chairman and past six year's former chairmen. In addition, there are 7 Honorary Advisors since 2000. Headquartered in Silicon Valley, California, CASPA has 11 local chapters worldwide: Albany New York, Austin & Dallas Texas; Phoenix Arizona; Portland Oregon; HsinChu Taiwan, Pearl River Delta (Hong Kong, ShenZhen), San Diego California, Shanghai, Beijing and Singapore. CASPA also forms alliance with other associations to promote welfare of its members. In 2004, CASPA reciprocates memberships with two of the largest professional organizations in the industry, SEMI and FSA.III. MembershipsCurrently CASPA has more than four thousand individual members covering multiple disciplines. Most of them are semiconductor professionals working in Silicon Valley, Southern California, Oregon, Washington, Arizona, Texas, New York, China, Taiwan, and Singapore. CASPA also has more than 70 corporate sponsors, including EDA, design, IDM, foundry, packaging / test, venture capital, science and technology development parks, legal and financial service companies located in the United States, Taiwan, Hong Kong, China, Singapore and Japan.IV. CASPA's activities1. Bi-monthly dinner meetings2. Conferences, Seminars, Workshops and Symposiums3. International and domestic Job Fairs4. CASPA Delegations to China, Taiwan, and Asia Pacific countries5. Hosting Delegations from China, Taiwan, and other Asia Pacific countries6. Annual banquet and special summer program.V. CASPA's publications1. Semimonthly eLtters2. Quarterly newsletters3. Annual Conference Proceeding4. Other conference and delegation proceedings

Chinese American Semiconductor Professional Association

Agenda 会议日程
           12:00 – 13:00 Registration 来宾登记
            13:00 – 13:30 Welcome Remark 开幕致辞
                     Brandon Wang, Chairman and President, CASPA
                     Ajit Manocha, President & CEO, SEMI
 Keynote Speech 主题演讲
           13:30-14:00   China’s Role in the Evolving Global IC Industry
                     Lung Chu, President, SEMI China; Vice President, SEMI
           14:00 – 14:30  The Dramatic Impact of RSIC-V on Speed of Innovation
                     Naveed Shervani, CEO，SiFive 
           14:30 – 15:00   The Essentials to Engineering a good Negotiation
                     Stuart Ching, former ARM SVP 
           15:00 – 15:30    Innovate and Win at China IC Industry
                     Mark Ding, President, SITRI Group
           15:30 - 16:00     Semiconductor Design in the Cloud
                     Craig Johnson, VP, Cadence
            16:10 – 17:00 Panel Discussion 主题论坛
                     Moderator主持人   Brandon Wang, Chairman and President, CASPA 
                     Panelist嘉宾    Luke Tang, General Manager, Techcode
                                             Jewei Li, Democratizing Autonomous Driving, COO, AutoX 
                                             Chris Nicol, CTO, Wave Computing
                                              Naveed Shervani, CEO，SiFive 
                                              Craig Johnson, VP, Cadence
                                               Lung Chu, President, SEMI China; Vice President, SEMI
 
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Intel Altera Auditorium, BLDG3

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CASPA 2018 Summer Symposium - SEMI SIIP Forum: Innovation at Scale-from IoT, Could to AI and ADAS

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CASPA 2018 Summer Symposium - SEMI SIIP Forum: Innovation at Scale-from IoT, Could to AI and ADAS

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