CASPA 2018 Spring Symposium: AI and Semiconductor Fusion - Part II Go Deep

I. Introduction of Chinese American Semiconductor Professional Association (CASPA)Founded in 1991, CASPA has developed into the largest Chinese American semiconductor professional organization worldwide. It is an officially registered non-profit organization with both the Internal Revenue Service and the State of California.CASPA charters1. Provide networking and business expansion for corporate sponsors and individual members2. Facilitate collaboration and communication among professionals and companies in the semiconductor industry3. Promote the welfare of the members by supporting their interests4. Exchange information regarding job opportunities and career development globally.II. OrganizationCASPA consists of individual members, corporate sponsors, board of directors, board of advisors, board of volunteers, and honorary advisors. The board of directors consists of 20 members including Chairman, Vice Chairman, Secretary, CFO. Every year after the annual conference, the new board select Vice Chairman from qualified candidates. The Vice Chairman becomes the Chairman in the following year to guarantee continuity of leadership of CASPA. The board of advisors consists of current year's chairman and past six year's former chairmen. In addition, there are 7 Honorary Advisors since 2000. Headquartered in Silicon Valley, California, CASPA has 11 local chapters worldwide: Albany New York, Austin & Dallas Texas; Phoenix Arizona; Portland Oregon; HsinChu Taiwan, Pearl River Delta (Hong Kong, ShenZhen), San Diego California, Shanghai, Beijing and Singapore. CASPA also forms alliance with other associations to promote welfare of its members. In 2004, CASPA reciprocates memberships with two of the largest professional organizations in the industry, SEMI and FSA.III. MembershipsCurrently CASPA has more than four thousand individual members covering multiple disciplines. Most of them are semiconductor professionals working in Silicon Valley, Southern California, Oregon, Washington, Arizona, Texas, New York, China, Taiwan, and Singapore. CASPA also has more than 70 corporate sponsors, including EDA, design, IDM, foundry, packaging / test, venture capital, science and technology development parks, legal and financial service companies located in the United States, Taiwan, Hong Kong, China, Singapore and Japan.IV. CASPA's activities1. Bi-monthly dinner meetings2. Conferences, Seminars, Workshops and Symposiums3. International and domestic Job Fairs4. CASPA Delegations to China, Taiwan, and Asia Pacific countries5. Hosting Delegations from China, Taiwan, and other Asia Pacific countries6. Annual banquet and special summer program.V. CASPA's publications1. Semimonthly eLtters2. Quarterly newsletters3. Annual Conference Proceeding4. Other conference and delegation proceedings

Chinese American Semiconductor Professional Association

AI and Semiconductor Fusion - Part II Go Deep
Artificial Intelligence (AI) has seen resurgence in recent years fueled by the advance in computational power, algorithms and large amount of data, which are propelled by the semiconductor chip technology. AI technology in turns creates new demand for semiconductor industry. The theme of the symposium will be  "AI and Semiconductor Fusion". This term was coined by CASPA in 2017 Annual Conference and become instantly popular among Semiconductor professionals and general tech audiences. We have historically high attendance in our annual conference. The 2018 spring symposium will go deeper on this theme with focus on the following areas:
(1). Deep learning applications and semiconductor solutions
(2). Enabling memory and computation technology for AI
 
Venue: Intel SC12 Auditorium, 3600 Juliette Ln, Santa Clara, CA 95054 Date: Saturday, March 3, 2018, 12pm – 5pm.
Agenda:
<DIV>
12:00 – 1:00pm Registration & Networking 1:00 – 1:05pm Symposium Opening Remarks Richard Yang, Ph.D., Executive Director of Symposium, CASPA
1:05 – 1:15pm Welcome from CASPA President Brandon Wang, President, CASPA
1:15 – 1:45pm FPGA Solutions for Artificial Intelligence and Machine Learning Vincent Hu, VP Strategy Innovation and Planning, Programmable Solutions Group, Intel
1:45 – 2:15pm Enhancing and Augmenting Human Perception and Health with Advanced Sensors and Artificial Intelligence Achin Bhowmik, Ph.D. chief technology officer and executive vice president of engineering. Starkey Hearing Technologies
2:15 – 2:45pm Future Computing and Hardware Jeffery Welser, Ph.D., VP and Lab Director, IBM Research, Almaden 2:45 – 3:00pm Break 3:00 – 3:30pm Unleashing Intelligence and Data Insights at Scale Wei Li, VP, Software and Services Group, General Manager of Machine Learning and Translation, Intel
3:30 – 4:00pm AI Trends and the Impact on Memory Systems Steven Woo, Ph.D., VP and Distinguished Inventor, Systems and Solutions Rambus Inc.
4:00 – 4:20pm Is It Time to Build Security in AI Chips? Lan Jenson, CEO, Adaptable Security Corp.
4:20 – 4:40pm Enabling 10,000 Custom AI Chips at Scale with RISC-V Yunsup Lee, CTO and Co-Founder, SiFive
4:40 – 5:00pm Closing Remark and Prize Drawing
</DIV>

Intel SC12 Auditorium

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CASPA 2018 Spring Symposium: AI and Semiconductor Fusion - Part II Go Deep

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