2017 Electronics Packaging Symposium & Workshop

Katelynn Hrywnak2017 EPS Administrative Chair(607) 777-5314khrywnak@binghamton.edu

Binghamton University - IEEC

The 29th Annual Electronics Packaging Symposium (EPS) is the premier electronics manufacturing conference of the Northeast, bringing together the best and brightest in the international electronics packaging industry. The 2017 Symposium will be held at GE Global Research in Niskayuna, New York, September 19-20, 2017 and will feature over 40 invited technical presentations and keynote speakers, a CPMT/IEEE workshop, a student poster session, and exhibits.
Topics for symposium include:
<UL>
<LI>Heterogeneous Integration      </LI>
<LI>Flexible & Additive Electronics  </LI>
<LI>Flexible Electronics for Medical Applications                       </LI>
<LI>Electronic Materials Sensors</LI>
<LI>Embedded Electronics & IoT                              </LI>
<LI>Thermal Challenges</LI>
<LI>Automotive & Harsh Environments                              </LI>
<LI>2.5/3D Packaging</LI>
<LI>Photonics & MEMS                             </LI>
<LI>Power Electronics                                                       </LI>
<LI>Materials for Packaging & Energy Storage</LI>
</UL>
Registration closes 5:00 p.m. EDT on Tuesday, September 12, 2017. No onsite registrations will be accepted. To gain entry to GE Global Research on day(s) of the conference, you must present a valid, government issued photo ID. For more information, visit <A HREF="http://go.binghamton.edu/eps2017" TARGET="_blank" DATA-MSYS-CLICKTRACK="0" REL="nofollow noopener noreferrer">go.binghamton.edu/eps2017</A>. Questions? Please contact Katelynn Hrywnak <A HREF="mailto:khrywnak@binghamton.edu" TARGET="_blank" REL="nofollow noopener noreferrer">khrywnak@binghamton.edu</A> or (607)727-3081.

GE Global Research Center

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2017 Electronics Packaging Symposium & Workshop

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2017 Electronics Packaging Symposium & Workshop

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