5th Intl. Conf. on Engineering Education and Information Technology EEIT-27
EEIT 2027 Theme "AI-Driven Innovation in Engineering Education"
2027 5th International Conference on Engineering Education and Information Technology (EEIT) will be held at Tokyo, Japan from March 27-29, 2027, which is sponsored by Kogakuin University, Japan. The conference provides a premier forum for presenting and discussing the latest advances in engineering education and information technology, bringing together researchers, educators, and industry professionals from around the globe.
With the theme of "AI-Driven Innovation in Engineering Education", EEIT explores how artificial intelligence and emerging technologies are reshaping educational paradigms. The conference will feature keynote speeches, invited talks, paper presentations, and interactive sessions covering curriculum design, intelligent learning systems, modern teaching methodologies, and the integration of AI in educational practices.
Proceedings Publication
All submitted papers will be subject to a rigorous double-blind peer review process to ensure academic quality and relevance. Accepted and presented papers will be published in the EEIT Conference Proceedings.
The digital proceedings will be distributed to all registered participants after the conference.
Conference Tracks
Submit your research in one of the four main tracks
Engineering Education Curriculum Reform
Innovative education, curriculum design, outcome-based education
Modern Information Theory & Application
AI, big data, blockchain, cloud computing, intelligent systems
Engineering Education Construction & Talent Training
Industry-education collaboration, professional development
Computer Network & Information Network Technology
IoT, cyber security, wireless communication, network protocols
Submission Guidelines
Full Paper (Publication & Presentation)
To publish the full paper into conference proceedings and give the oral presentation, please send us the full paper.
Follow the template when preparing your full paper: https://eeit.net/IEEE-template-letter.docx
Language: All papers must be written in clear, correct, and concise English. Papers with poor language quality may be rejected without review or returned to the author for language polishing.
Full paper page limit: Papers must be no more than 5 pages (A4 size, two-column format) including figures and references. Extra pages beyond 5 pages may incur additional fees.
Abstract (Oral Presentation only, without publication)
Authors who wish to present the paper at the conference may choose to submit an abstract only. The abstract should clearly summarize the paper's objectives, key results, and conclusions and be understandable on its own. If accepted, you'll give an oral presentation, but your paper will NOT be published.
Abstract Template: https://eeit.net/Abstract-template-a4.docx
Attendance Only
If you only want to attend the conference without any submission, please just register as Delegates.
Submission Method (PDF Only)
Please choose one method only. Do not submit twice to avoid any inconvenience caused by duplicated submission.
Option one: Electronic Submission System: https://www.zmeeting.org/submission/eeit2027
Option two: eeit_general@163.com
More information, please visit: https://eeit.net/sub.html
Call for Special Sessions
EEIT 2027 invites researchers, educators, and industry professionals to propose Special Sessions that address emerging topics in engineering education and information technology. Special sessions provide a focused platform for in-depth discussions on innovative research areas, bringing together experts and enthusiasts to exchange ideas and foster collaboration.
We welcome proposals that explore cutting-edge developments, interdisciplinary approaches, and practical applications in the broad field of engineering education and information technology. Special sessions can cover theoretical foundations, empirical studies, technological innovations, and pedagogical practices.
Call For Reviewers
Technical Committee members play a vital role in the success of the conference by providing professional expertise. Your reviews help the Program Committee make acceptance decisions, improve the quality of authors’papers and presentations, and identify outstanding papers.
Criteria for Being a Reviewer
Hold a doctoral degree in a relevant academic field.
Have established expertise and professional experience in the relevant area.
Demonstrate a strong publication record in reputable, high-impact, peer-reviewed journals.
Possess broad knowledge of the relevant disciplines and sub-fields.
Have prior experience reviewing abstracts or full manuscripts and/or serving on journal editorial boards.
Demonstrate strong command of academic language, writing, and grammar.
Benefits for Being a Reviewer
Have your name and affiliation listed as a Technical Committee member on the conference website and in the printed proceedings.
Receive a special discount on the conference registration fee.
Receive an electronic certificate recognizing your contribution as a reviewer.
Stay informed about the latest research and emerging developments in your field.
Enhance your academic CV and professional profile for promotion and/or tenure.
Expand your professional network by connecting with researchers and scholars in your field.
Gain valuable experience in academic peer review and contribute to maintaining the quality and integrity of scholarly research.
The final decision regarding the selection will be made by the Technical Committee Chair. If you would like to be considered to serve on the Technical Committee, please send your latest CV to E-mail: eeit_general@163.com
Contact Us
Conference Secretary: Ms. Ellie Lee
E-mail: eeit_general@163.com
Working Hours: Monday-Friday 09:30-18:00
Good to know
Highlights
- 2 days 8 hours
- In person
Refund Policy
Location
TKP Tokyo Station Conference Center
16
#10~12階 Chuo City, Tokyo 103-0028
How do you want to get there?

Agenda
Mar 27, 2027
Sign-in and Materials Collection
Mar 28, 2027
Welcome & Opening Remarks & Keynote Sessions, Technical Sessions
Mar 29, 2027
Technical Sessions