Thermal Analysis for Thermal Challenges with Heterogeneous Packaging

IEEE SFBA Nanotechnology Council Chapter

San Francisco Bay Area IEEE Nanotechnology Council

EAG Laboratories

San Francisco Bay Area IEEE Nanotechnology Council2020, 2017 &amp; 2014 Nanotechnology Council Outstanding Chapter (world-wide)2019, 2016 &amp; 2014 IEEE Outstanding Chapter (Western USA)2019, 2016 IEEE Outstanding Chapter (Santa Clara Valley)<a href="http://sites.ieee.org/sfbanano" title="http://sites.ieee.org/sfbanano" target="_blank" data-msys-clicktrack="0" rel="nofollow noopener noreferrer">http://sites.ieee.org/sfbanano</a> <h1>Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging</h1><h1> </h1> <h1>Dustin Kendig</h1><h3>Co-Founder and Vice President of Microsanj LLC in Santa Clara, California</h3><h3> </h3><h3>In-Person Meeting</h3>Thursday, March 6, 202511:30 AM: Networking, Pizza &amp; DrinksNoon -- 1 pm: Seminar--------Please register on Eventbrite before 9:30 AM on Thursday, , March 6, 2025Walk-In attendance is welcomed but discouraged (cash or check; no credit cards)Please assist us in our event planning!If you decide not to attend... - please cancel reservations by 8:00 AM on Thursday, ** Tickets cancelled by 8 AM on March 6 will have payments refunded*** Note: Eventbrite Fees will not be refunded Location:<h3>EAG Laboratories</h3>810 Kifer Road, Sunnyvale==&gt; Use corner entrance: Kifer Road / San Lucar Court==&gt; Do not enter at main entrance on Kifer Road(Parking: on street or in parking lot behind EAG)

<h3>Abstract:</h3> <h3>With the commercialization of thermoreflectance thermal imaging Microsanj has met many of the thermal challenges inherent with today’s advanced devices. </h3> <h3>The thermoreflectance principle exploits the fact that the reflectivity of a material changes with temperature. By measuring the reflectivity change with probing wavelengths in the visible band, this technique supports thermal measurements with diffraction limited spatial resolution in the sub-micron range and a temporal response in the nanosecond range. </h3> <h3>New thermal analysis challenges are arising with current trends and advances in heterogeneous packaging techniques. To address these new challenges, Microsanj is developing enhancements and new products. A brief description of these techniques including optical pump-probe imaging, flash thermography, over-the-air imaging for the analysis of embedded antennas, and others approaches being investigated will be provided in this presentation.</h3>

<h3>Speaker Bio:</h3> <h1>Dustin Kendig </h1><h3>Dustin Kendig is Co-Founder and Vice President of Microsanj LLC in Santa Clara, California. </h3> <h3>At Microsanj he is developing sub-micrometer transient thermal imaging systems for the semiconductor industry for thermal characterization and fault isolation. Microsanj has 75+ commercial products and research partnerships with companies and research labs in a dozen countries. </h3> <h3>He is a member of the IEEE Instrumentation and Measurement and Reliability Societies. In 2009, he was the recipient of the Huffman Prize, Dean’s Award, and Chancellor’s Award. He won best poster at IEEE PVSC in 2010 and best paper at IEEE ITherm in 2017. He holds 4 patents and has published over 60 papers. </h3> <h3>Dustin Kendig received his B.S. Degree with Honors in Electrical Engineering from the University of California, Santa Cruz.</h3>

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When it comes to understanding the physical structure, chemical properties and performance of advanced materials and integrated circuitry, no other scientific services company offers the breadth of experience, diversity of analytical techniques or technical ingenuity of EAG Laboratories. We deliver multi-disciplinary, problem-solving expertise to help our customers accelerate innovation, ensure quality and safety, and protect intellectual property.

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Thermal Analysis for Thermal Challenges with Heterogeneous Packaging

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Thermal Analysis for Thermal Challenges with Heterogeneous Packaging

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