ISAI 2026 / All about AI - 2026 the 6th International Symposium on AI

ISAI 2026, 2026 the 6th International Symposium on AI. It‘s an event on research related to learning and reasoning in the presence of AI. ISAI 2026 will be held in Chengdu, China, on April 24-26, 2026.

ISAI.ORG

Sponsored by Sichuan Institute of Electronics;

Co-hosted by Southwest Jiaotong University, Xihua University, and University of Electronic Science and Technology of China;

Hosted by Youth Talent Work Committee, Sichuan Institute of Electronics;

Patrons are CNGB (China National GeneBank), Key Lab of Cloud Computing & Intelligent Technology, Sichuan Province, and Chongqing University of Posts and Telecommunications, etc...

Publication

Submitted paper will be peer reviewed by conference committees, and accepted papers will be included in conference proceedings, indexed by EI Compendex & Scopus.

Submission

Papers submitted to the conference should be in English and within 4-12 pages.

- Accepted Full Paper will be invited to give the presentation at the conference and it'll be published in the conference proceedings.

- Accepted Abstract will be invited to give the oral presentation at the conference, but the presentation WILL NOT be published.

→Submission System: https://www.zmeeting.org/submission/isai2026

*Paper Template: https://isai.org/instruct8.5x11x2.doc

More detail about submission, please via https://isai.org/sub.html

Contact us via isai_conf@163.com

Conference Chairs

Tianrui Li, Southwest Jiaotong University, China
Xianhua Niu, Xihua University, China

Conference Co-chair
Chongshou Li, Southwest Jiaotong University, China

International Advisory Committee

Qingfu Zhang, City University of Hong Kong, China
Nirwan Ansari, New Jersey Institute of Technology, USA
Rajkumar Buyya, The University of Melbourne, Australia
En-Bing Lin, Wentworth Institute of Technology, USA

Technical Program Co-chairs
Jixin Ma, University of Greenwich, UK
Shengke Zeng, Xihua University, China
Giuseppina Gini, Politecnico di Milano, DEIB, Italy
Zhengyao Yi, Dalian University of Technology, China
Hongmei Chen, Southwest Jiaotong University, China

Technical Program Vice-chair
Jianhong Zhou, Xihua University, China

Publicity Co-chairs

Eric Yew Kee WONG, Hong Kong Chu Hai College, China
Chao Qi, Xihua University, China
Fengmao Lv, Southwest Jiaotong University, China

Regional Chairs
Yoshifumi Manabe, Kogakuin University, Japan
Jinwei Liu, Florida A&M University, USA

Publication Chairs

Dong-Her Shih, National Yunlin University of Science and Technology
Qing Tan, Athabasca University, Canada
Peng Chen, Xihua University, China

Financial Chair

Monica M. Xiao, Xihua University, China

Local Arrangement Chairs
Chao Qi, Xihua University, China
Ling Xiong, Xihua University, China
Jie Hu, Southwest Jiaotong University, China