IEEE SF Bay Area MEMS and Sensor Chapter and Northeastern University – Silicon Valley present a joint workshop on Flexible / Printed / Fabric Sensors and Systems.

General Chair: Roger Grace, Roger Grace Associates | Technical Chair: Ramesh Ramadoss, IEEE
Organizing Committee: P.K. Agarwal; Rick Davis, Northeastern University; Brent Lunceford, IEEE
Host: P. K. Agarwal, Northeastern University – Silicon Valley

In recent years, there has been an exponential growth in the field of flexible, printed and organic large-area electronics and sensors. These new printed electronics and sensors are fabricated on flexible plastic substrates, which offer advantages such as mechanical flexibility, light weight and low profile. The use of flexible plastic substrates enables low cost high-speed manufacturing of devices over large areas using printing technologies in a Roll-to-Roll production line. Targeted applications include wearables, environmental monitoring and eHealth.

Recently, the U.S. Department of Defense (DoD) awarded $75M to FlexTech Alliance to establish and manage a San Jose-based hub and node approach to create a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII). Additionally, the recent award of $75M , again by the US DoD, with $250M in matching grants from industry and academia for the creation of a research and development consortia headed by MIT for the development of ”Functional Fabrics” has validated the potential of this technology to create “smart fabrics” for consumer and military wearable applications.

This one-day workshop will bring together experts and leaders in this area to the heart of Silicon Valley. The workshop will consist of presentations on the topics of printed/flexible/fabric sensors, accompanying electronics and applications, as well as the current and future opportunities. The event will include an interactive panel discussion on the future of this rapidly growing market and the potential barriers to their commercialization. Continental breakfast, lunch and the concluding evening networking mixer is included.

Agenda:

8:00 AM – 9:00 AM
Continental Breakfast and Networking

9:00 AM – 12:00 PM
Session I: Sensors

12:00 PM – 1:00 PM
Lunch Break

1:00 PM – 4:00 PM
Session II: Systems

4:00 PM – 5:00 PM
Interactive Panel discussion

5:00 PM – 6:00 PM
Cocktail Reception and Networking