Sep

31st Annual Electronics Packaging Symposium- Small Systems Integration

by Integrated Electronics Engineering Center (IEEC)

Event Information

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Date and Time

Thu, Sep 5, 2019, 7:30 AM –

Fri, Sep 6, 2019, 4:00 PM EDT

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Location

GE Research

1 Research Circle

Niskayuna, NY 12309

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Registration is closed. Thank you for your interest and we hope to see you for our 2020 symposium next Fall at Binghamton University!

Event description

GE Research and IEEC-Binghamton University are proud to host the 31st Annual Electronics Packaging Symposium- Small Systems Integration.

About this Event

*LAST DAY TO REGISTER: AUGUST 26, 2019!*

GE Research and IEEC-Binghamton Univerisity invite you to attend this two-day event on September 5 and 6, 2019 at GE Research Center in Niskayuna, NY.

Our keynote speakers this year are:

Mukesh V. Khare - Vice President- Semiconductor & AI Hardware, IBM Research

Joseph M. Kolly - Chief Safety Scientist, National Highway Traffic Safety Administration

Brett Hamilton - Distinguished Scientist for Trusted Microelectronics, Naval Surface Warfare Center

Benjamin Leever - Technical Director, Industrial and Manufacturing Technologies, Airforce Research Laboratory

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:

• 2.5/3D Packaging

• mm Wave in Packaging

• Automotive & Harsh Environments

• Bioelectronics

• Flexible & Additive Electronics

• Materials for Packaging & Energy Storage

• MEMS

• Photonics

• Power Electronics

• Sensors, Embedded Electronics & IoT

• Thermal Challenges

• Wearable and Flexible Electronics for Medical Applications

Agenda : https://www.binghamton.edu/ieec/2019eps/agenda.html

This year's program includes 12 sessions with technical presentations, a half-day IEEE EPS Heterogeneous Integration Roadmap workshop on September 6, a student poster session with students from local Universities in NY, and exhibits from leading companies.

We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share ones expertise, learn, and build partnerships.

We highly encourage graduate students to join us in the poster session to showcase their research! Make sure to register before AUGUST 26!

Registration , required forms and program details can be found on our website:

https://www.binghamton.edu/ieec/2019eps/

REGISTER TODAY and join a community which seeks advancement in the electronics packaging field. We look forward to seeing you this fall.

Sincerely,

2019 EPS Organizing Committee