2nd IEEE Intl. Conf. on Software System and Information Processing -ICSSIP

2025 the International Conference on Software System and Information Processing (ICSSIP) will be held in Chengdu, China on December 26-28, 2025. It is co-sponored by University of Electronic Science and Technology of China and IEEE, hosted by School of Information and Communication Engineering (UESTC), China.

https://www.icssip.net/

Publication & Indexing

All papers will be subject to double-blind reviews and accepted papers will be submitted for inclusion into ICSSIP conference proceedings by IEEE, included into IEEE Xplore, and submitted for Ei Compendex and Scopus.

ICSSIP 2024 丨IEEE Xplore 丨Ei Compendex and Scopus

Call for General Papers

Track I: Emerging electronic systems and Frontiers Development Technologies

Track II: Computer Vision and Intelligent Image Processing

Track III: Key Technologies and Challenges in Future Communication Systems

Track IV: Digital Signal Analysis and Processing Methods

Submission Guide

Submission System: http://confsys.iconf.org/submission/icssip2025
Note: If an author doesn't have an iConf account, you need to create an account first. Then, log in with the created account. Then, click on the "Submit" sign.

ADVISORY COMMITTEE
Guan Gui, Nanjing University of Posts and Telecommunications, China (Fellow, IEEE)
Dave Towey, University of Nottingham Ningbo China, China

HONORARY CHAIR
Kun Yang, Nanjing University, China (Fellow, IEEE)

GENERAL CHAIR
Supeng LENG, University of Electronic Science and Technology of China, China

PROGRAM CHAIRS
Yizhe Zhao, University of Electronic Science and Technology of China, China
Kai-Kit Wong, University College London (UCL), UK (Fellow, IEEE)
Ioannis Krikidis, University of Cyprus, Cyprus (Fellow, IEEE)
Sangarapillai Lambotharan, Loughborough University, UK (Senior Member , IEEE & FIET )
Guobing Li, Xi'an Jiaotong University, China

PUBLICITY CHAIRS
Yong Jia, Chengdu University of Technology, China (Member , IEEE)
Xuebo Zhang, Northwest Normal University, China (Member , IEEE)
Tiezhu Li, Henan University, China
Feibo Jiang, Hunan Normal University, China

PUBLICATION CHAIR
Yuki Lian, Chengdu Young Education, China

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