The 3rd Annual Design for Reliability Conference hosted by DfR Solutions includes two full days of presentations, a full day of Sherlock Users Advanced Technical Training, and a half day Battery Reliability Workshop. Leaders from automotive, aerospace, communications, computers, and other Fortune 500 technology companies will join DfR Solutions to explore how integrating Reliability Physics into processes today ensures safe, reliable innovations for tomorrow.

Monday, March 25, 2019

8am - 5pm

• Case Study: How Continental Automotive is Integrating Sherlock into their Design Process
• What’s New with Sherlock?
• Will Your Battery Protection System and UL Test Prevent Catastrophic Li Ion Failures?
• Warranty-Reliability-Maintainability: How Optimal+/Sherlock Allow for Comprehensive Prediction Throughout the Product Lifecycle
• DfX in Electronics Packaging
• Case Study: Solder Fatigue Model Verification using NAND BGAs
• Best Practices in Reliability Management of Consumer Electronics
• Electrical Overstress (EOS) in Semiconductors: An Introduction to Electrically Induced Physical Damage

There will be a welcome reception after the conference sessions. Stay tuned for details.

Tuesday, March 26, 2019

8am - 5pm

• How to Implement a Proactive Approach to Identifying Reliability Risks
• Using Simulation to Optimize Microvia Placement and Materials to Avoid Failures During Reflow
• A Corporate-Level Process Flow to Ensure Quality and Reliability
• Case Study: Using RPA to Predict Thermal Cycling BGA Failures for Aircraft Engines
• How to Use Sherlock to Perform a Pre-HALT
• Accurately Capturing System-Level Failures of Solder Joints (Underfill, Mirroring, Housing)
• Reliable Sensors Engineering: Key Enabler for Commercial Autonomous Vehicles
• How to Successfully Implement J3168 SAE Standards in Your Supply Chain
• Understanding and Mitigating Chip-Package-Board Interactions (CPBI)

Wednesday, March 27, 2019

Track 1

Sherlock Automated Design Analysis™ Software Advanced Users Technical Training

8am - 5pm
Laptops required

• Starting a Sherlock project: Defining Lifecycles, Critical Components, and Mechanical Loading.
• Solving Thermal Mechanical and ICT problems, one Sherlock project at a time
• Live Demo: Your Sherlock projects, reviewed live!
• Q&A Ask Us Anything

OR

Track 2

How to Qualify Your Batteries to Prevent Failures & Thermal Events

8am - 12pm

Instructor: Vidyu Challa, PhD, Technical Director, DfR Solutions

The rising demand for Internet of things (IoT) and machine-to-machine (M2M) applications makes battery power an absolute necessity. However, reports about lithium-ion batteries exploding and catching fire continue to draw the public’s attention. How do you balance the need for power, size, cost, and time-to-market, while still avoiding being the lead story on the evening news?

Is it enough to qualify a cell manufacturer according to industry standards? The answer is that the majority of compliance-based testing is related to abuse tolerance. However, the vast majority of field failures do not occur under abuse scenarios, but happen under normal operating conditions due to manufacturing flaws or design and system tolerance issues that cause internal shorts. Internal shorts are unfortunately not mitigated by safety electronics.

In this battery workshop, you:

• Gain an understanding of lithium-ion battery failure mechanisms and the pathway to thermal runaway events
• Learn about the top causes of battery field failures, and the major areas where you need to have mitigation strategies
• Learn how cell design plays a critical role in battery safety and reliability, and what you can do from a design perspective to prevent these failures
• Learn the basic steps in a lithium-ion cell manufacturing process, and the process controls required to ensure cell safety and reliability
• Learn about the battery management system and its role in system safety
• Come away with a checklist of things you should do to qualify your cell manufacturer – pass down requirements, trust but verify (design, manufacturing, compliance-based testing, system-level tolerances, application-specific battery testing, battery management system, cell CT scans and teardowns and lastly user education)

Poster Sessions

• Risks of Wide Band Gap (WBG) Semiconductors in Power Supply Applications
• Predicting the Failure Rate of Next Generation Integrated Circuits using Reliability Physics presented
• Design for Reliability for Connectors: A Review of Failure Modes and Mitigations
• Accelerated Radiation Susceptibility Analysis and Prediction (RadSAP) Tool
  
• Extending Product Life of Electronic Systems through Reliability Centered Maintenance (RCM)
• Practical application of AEC requirements for automotive components (passives and ICs)
• Key Lessons from Performing Finite Element Analysis (FEA) on Semiconductor Packaging, Printed Circuit Boards, and Electronic Assemblies,

View the Complete Conference Agenda Here

Need hotel accommodations? DfR Solutions has secured limited hotel room availability at a special rate for attendees who wish to stay overnight at the Hyatt Regency during the conference. Discounted rooms are offered on a first come, first serve basis. Reservations can be made here.