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Visualizing the Packaging Roadmap - Ivor Barber, Corporate VP for Packaging, AMD

IEEE-Electronics Packaging Society/SCV

Wednesday, March 13, 2019 from 11:30 AM to 1:00 PM (PDT)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Mar 12, 2019 $5.00 $1.27
2: non IEEE Members
Members: use this if member category is sold out
Mar 12, 2019 $10.00 $1.53
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Mar 13, 2019 Free $0.00
4: Late*: IEEE members
* Online reg starts at 1PM day-before event.
Not Started $10.00 $1.53
5: Late*: non IEEE Members
* Online reg starts at 4PM day-before event.
Not Started $15.00 $1.78

Share Visualizing the Packaging Roadmap - Ivor Barber, Corporate VP for Packaging, AMD

Event Details

11:30 AM - 12:00 PM: Check-in / networking - FOOD [PIZZA]
12:00 PM: Presentation
 
Registration [refreshments and talk]:
 
IEEE Members:   [also for all students and all unemployed] : $  5.00
   [if sold out please use non-MEMBER category]
 
non-IEEE members: $10.00 
 
WE USUALLY GET PRESENTER SLIDE DECK, but sometimes not. When speaker provides it, in original or sanitized form, it will be uploaded at the chapter website - cpmt.org/scv.  Older presentation may also be accessed. 

Summary:

With the end of Moore’s Law as an economic driver at 28nm, and publication of the final edition of the ITRS in July 2016, we find packaging is now on the center stage of semiconductor innovation — but what roadmap do we follow? This presentation will discuss prior roadmaps and how the packaging industry is responding with a product-based integrated solution roadmap. The presenter will discuss the goals of Heterogeneous Integration for High Performance Computing Applications and the packaging solutions this will drive.

Bio:

Ivor Barber  is currently Corporate VP for Packaging at AMD with responsibility for all Packaging activity from Design through High Volume Manufacturing. With over 35 years experience in the Semiconductor Industry, Ivor has held various Engineering and Management positions in Assembly, Package Characterization and Package Design at National Semiconductor, Fairchild Semiconductor, VLSI Technology, LSI Corporation and Xilinx. Ivor graduated from Napier University in Edinburgh, Scotland with a Bachelors degree in Technology and holds 15 US patents related to packaging.

 

ITRS, Moore’s Law, innovation, roadmaps, packaging issues, hi-performance computing, solutions

Have questions about Visualizing the Packaging Roadmap - Ivor Barber, Corporate VP for Packaging, AMD? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035

Wednesday, March 13, 2019 from 11:30 AM to 1:00 PM (PDT)


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