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Trends in Si Photonics Packaging for Networking Applications: Jie Xue-VP,Cisco

IEEE-Electronics Packaging Society/SCV

Thursday, December 19, 2019 from 11:30 AM to 1:00 PM (PST)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Dec 18, 2019 $5.00 $1.27
2: non IEEE Members
Members: use this if member category is sold out
Dec 18, 2019 $10.00 $1.53
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Dec 18, 2019 Free $0.00
4: Late*: IEEE members
* Online reg starts at 12 noon day-before event.
Not Started $10.00 $1.53
5: Late*: non IEEE Members
* Online reg starts at 12 noon day-before event.
Not Started $15.00 $1.78
6: Late: Talk-only ((Please arrive by 11:45am) [IEEE members: please enter membership info when prompted] Not Started Free $0.00

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Event Details

11:30 AM - 12:00 PM: Check-in / networking - FOOD [PIZZA]
12:00 PM: Presentations
 
PLEASE NOTE: this is a THURSDAY event.
 
Registration [refreshments and talk]:
 
IEEE Members:   [also for all students and all unemployed] : $  5.00
   [if sold out please use non-MEMBER category]
 
non-IEEE members: $10.00 
 
Eventbrite does not refund fees . EPS/SCV will absorb these for now, unless we see excessive cancellations.
 
 
WE USUALLY GET PRESENTER SLIDE DECK, but sometimes not. When speaker provides it, in original or sanitized form, it will be uploaded at the chapter website - cpmt.org/scv.  Older presentation may also be accessed. 

Summary:

This talk will cover the new industry roadmap for high speed optics for large scale datacenters, interconnects, and long-haul networking applications using Silicon Photonics technologies, as well as discuss challenges/opportunities in SiPh packaging to enable this roadmap and pave the path for eventual integration of Switching ASICs that include Optics (aka: In-Package Optics).

Bio:

 Jie Xue  leads Cisco’s Technology and Quality organization, a global team responsible for anticipating, developing, and providing technology innovations in support of Cisco’s supply chain. The team drives a competitive advantage by ensuring innovation and excellence in manufacturing technology, test and component engineering, advanced technology development, closed-loop quality management, and product compliance. These range from 100G heterogeneous silicon photonics to high-speed connectors and 2.5D/3D technologies, advanced PCBs, thermal cooling solutions, and advanced algorithms for automated decision-making.

Jie is an Institute of Electrical and Electronics Engineers (IEEE) Fellow, an International Microelectronics Assembly and Packaging Society (IMAPS) Fellow, an IEEE-Electronics Packaging Society (EPS) Distinguished Lecturer and served as President of EPS from 2014 to 2015. As President of EPS, she spearheaded the rebranding and revitalization of the Society to keep pace with the evolving microelectronics industry. She is a published author of more than 90 technical papers, hold 12 patents, and has served as a keynote speaker for domestic and international conferences.

 

SiPh packaging, large-scale data centers, interconnects, long-haul networking, Roadmap, integration 

Have questions about Trends in Si Photonics Packaging for Networking Applications: Jie Xue-VP,Cisco? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035

Thursday, December 19, 2019 from 11:30 AM to 1:00 PM (PST)


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