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System in Package (SiP) for Miniaturized Electronics Modules: An Update - Dr. Dongkai Shangguan, Vice President – Technology, Design & Engineering, Flex

IEEE-Electronics Packaging Society/SCV

Wednesday, October 2, 2019 from 11:30 AM to 1:30 PM (PDT)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Ended $5.00 $1.27
2: non IEEE Members
Members: use this if member category is sold out
Ended $10.00 $1.53
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Ended Free $0.00
4: Late*: IEEE members
* Online reg starts at 12 noon day-before event.
Ended $10.00 $1.53
5: Late*: non IEEE Members
* Online reg starts at 12 noon day-before event.
Ended $15.00 $1.78
6: Late: Talk-only ((Please arrive by 11:45am) [IEEE members: please enter membership info when prompted] Ended Free $0.00

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Event Details

11:30 AM - 12:00 PM: Check-in / networking - FOOD [PIZZA]
12:00 PM: Presentations
 
Registration [refreshments and talk]:
 
IEEE Members:   [also for all students and all unemployed] : $  5.00
   [if sold out please use non-MEMBER category]
 
non-IEEE members: $10.00 
 
Eventbrite does not refund fees . EPS/SCV will absorb these for now, unless we see excessive cancellations.
 
 
WE USUALLY GET PRESENTER SLIDE DECK, but sometimes not. When speaker provides it, in original or sanitized form, it will be uploaded at the chapter website - cpmt.org/scv.  Older presentation may also be accessed. 

Summary:

This presentation will review the SiP technology landscape, and discuss various solutions and competency requirements, for miniaturized modules for system integration across market segments. Reliability considerations for miniaturized devices and materials requirements for high-frequency applications will be discussed. Development of flexible electronics modules will be discussed as well.

Bio:

 

Dr. Dongkai Shangguan is currently Vice President for Advanced Manufacturing Engineering at Flex. Previously, he served as the Chief Marketing Officer of STATS ChipPAC. Early in his career, Dr. Shangguan spent 10 years with Ford Motor Co. and Visteon Corporation where he held various technical and management responsibilities, and then 11 years at Flextronics where he was Vice President of Advanced Technology and Engineering Leadership.

Dr. Shangguan is an IEEE Fellow and has served on the iNEMI Board of Directors, the IEEE CPMT Society Board of Governors, and the IPC Board of Directors. He has received a number of recognitions for his contributions to the electronics industry, including the Outstanding Sustained Technical Contribution Award from IEEE CPMT, the William D. Ashman Achievement Award from IMAPS, Presidents Award from IPC, and Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers.

Dr. Shangguan received his Bachelor of Science degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral teaching and research at the University of Cambridge and The University of Alabama. Dr. Shangguan has published two books, authored/co-authored 250 technical papers and articles, and has been issued over 20 patents.

 

miniaturized modules, technology landscape, requirements, solutions, flexible electronics

Have questions about System in Package (SiP) for Miniaturized Electronics Modules: An Update - Dr. Dongkai Shangguan, Vice President – Technology, Design & Engineering, Flex? Contact IEEE-Electronics Packaging Society/SCV

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