Skip Main Navigation
Page Content

Save This Event

Event Saved

System Assembly using a Microchip Printer: Dr. Eugene Chow, Principal Scientist - PARC

IEEE/EPS/SCV

Thursday, January 24, 2019 from 11:30 AM to 1:00 PM (PST)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members: Refreshments and Talk
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Jan 23, 2019 $5.00 $1.27
2: non IEEE Members: Refreshments and Talk
Members use this if member category is sold out
Jan 23, 2019 $10.00 $1.53
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Jan 24, 2019 Free $0.00
4: Late/ Walk-in *: IEEE members: Refreshments and Talk
* Online reg starts at 4PM day before event. talk-only is free.
Not Started $10.00 $1.53
5: Late/ Walk-in *: non IEEE Members: Refreshments and Talk
* Online reg starts at 4PM day before event. talk-only is free.
Not Started $15.00 $1.78
Cannot attend this -- PLEASE add name to list for future event notices Jan 24, 2019 Free $0.00

Share System Assembly using a Microchip Printer: Dr. Eugene Chow, Principal Scientist - PARC

Event Details

11:30 AM - 12:00 PM: Check-in / networking - PIZZA
12:00 PM: Presentation
 
Registration [refreshments and talk]:
 
IEEE Members:   [also for all students and all unemployed]
  Pre-registration: $  5.00
   [if sold out please use non-MEMBER category]
  Walk-in  *:         $10.00     
 
non-IEEE members:
   Pre-registration: $10.00
   Walk-in * :         $15.00
 
*: on a food available basis; talk-only is free any way.
 
[This signs you up for talk too, please do not also register for Talk-Only]

Registration for Talk-Only: FREE
Talk-Only attendees: please check-in by 11:45AM
 
Summary:
We aim to develop a system which could rapidly assemble small semiconductor chips (<1mm) into electronic systems.  The process uses chips initially in solution, and then sorts, transports, and orients chips with directed electrostatic assembly with open and closed loop control.  Assemblies are then transferred to final substrates with a stamp or continuous feed roll-based method, and then electrically interconnected.  The current laboratory systems have handled small chips (10um-500um) and demonstrated fine registration (less than 1um, and less than 1deg).
 
Ultimately, massively parallel automated microassembly, analogous to a xerographic (laser) printer where the toner are instead chips, could be used for integrating circuits, microLEDs and other semiconductor components into complex, heterogeneous systems.

Bio:

Dr. Eugene Chow is a principal scientist and manager of the microsystems research group at PARC (a Xerox Company). The group works on novel printing-related processes, electronics and biomedicine. In the advanced electronics packaging area he focuses on lithographically defined microspring flip chip interconnects for integrated test, rework and packaging, and automated chiplet assembly. He leads research projects at PARC with support from Xerox, other companies and the government, and has ~100 patents granted/filed. He earned a B.S. from UC Berkeley in engineering physics, and did graduate work at Stanford University (MS engineering management, MS and PhD in electrical engineering).

 

chiplets, electrostatic assembly, sort, transport, roll-based, planarization, interconnect, HI

Have questions about System Assembly using a Microchip Printer: Dr. Eugene Chow, Principal Scientist - PARC? Contact IEEE/EPS/SCV

Save This Event

Event Saved

When & Where


Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95054

Thursday, January 24, 2019 from 11:30 AM to 1:00 PM (PST)


  Add to my calendar

Please log in or sign up

In order to purchase these tickets in installments, you'll need an Eventbrite account. Log in or sign up for a free account to continue.