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Roll-to-roll Manufacturing in Electronics: Making it Work? Peter Salmon

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Tuesday, January 10, 2017 from 11:30 AM to 1:30 PM (PST)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members: Refreshments and Talk   more info Jan 9, 2017 $5.00 $0.00
2: non IEEE Members: Refreshments and Talk Jan 9, 2017 $10.00 $1.49
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Jan 10, 2017 Free $0.00
4: Late/ Walk-in: IEEE members: Refreshments and Talk Not Started $10.00 $0.00
5: Late/ Walk-in: non IEEE Members: Refreshments and Talk Not Started $15.00 $1.74

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Event Details

Roll-to-roll Manufacturing in Electronics: Making it Work?
  Peter Salmon, Salmon Engineering
 
 
11:30 AM - 12:00 PM: Check-in / networking - light food
12:00 PM: Presentation
 
Registration [refreshments and talk]:
 
IEEE Members:  [also for students and unemployed]
  Pre-registration: $  5.00
  Walk-in:              $10.00     
 
non-IEEE members:
   Pre-registration: $10.00
   Walk-in:              $15.00
 
[This signs you up for talk too, please do not also register for Talk-Only]

Registration for Talk-Only: FREE
Talk-Only attendees: please check-in by 11:45PM
 

Summary:

A new concept for roll-to-roll fabrication is presented. A key component of each deposition station in the proposed roll-to-roll system is a charge-array wafer. The charge-array wafer enables two disruptive innovations: 1) “active registration” wherein the target substrate is continually seeking precise alignment, even as it moves through a deposition station; and 2) electronic programming of the desired pattern for each deposition layer.

A potential product evolution is described, beginning with flexible printed circuits (FPCs) having 1-mil line and space. Then FPCs with embedded passives, Hybrid Electronic Systems (HES) having attached flip chips, and finally complex electronic systems incorporating FPCs, embedded passives, flip chips, and thin-film transistors. The complex systems may include novel structures that are not currently found on PCBs.


Bio:

Peter Salmon  received his BE degree in Electrical Engineering from Auckland University, New Zealand. He emigrated to the United States and obtained MSEE and EE degrees at Northeastern University. He has enjoyed an eclectic career, including 10 years at Intel and Fairchild Semiconductor as a chip designer, 10 years at TRW and GTE as a systems engineer for large defense systems, almost 10 years founding startup companies involving thermal and electrostatic printing technologies, and a few more years as an engineering consultant and expert witness. He is a co-founder of i-Blades, Inc. which is pioneering new markets in attachments to smart phones; he developed the base technology for magnetic and electrical coupling. He has been awarded a first patent on his roll-to-roll technology, and a second one is pending.


 

 

 

CPMT   charge-array, deposition, registration, evolution, flip-chip and TFTs

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When & Where


Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95054

Tuesday, January 10, 2017 from 11:30 AM to 1:30 PM (PST)


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