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Moldflow Chicago User Group

Autodesk Simulation Team

Thursday, February 20, 2014 from 12:00 PM to 4:00 PM (CST)

Schaumburg, Il

Moldflow Chicago User Group

Ticket Information

Type End     Quantity
Moldflow Chicago User Group Ended Free  

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Event Details

Come join fellow Moldflow professionals and...

  • Interact with local plastics professionals as well as the Autodesk Moldflow Technical staff
  • Learn about what's new in the latest Moldflow software and receive an upcoming technology preview
  • Provide feedback to Moldflow staff on what you want to see in future releases


Agenda

  • 12:00 PM              Registration, Lunch and Networking
  • 1:00 PM                What's New in Moldflow & New Technology Preview
  • 2:00 PM                Break
  • 2:15 PM                Tutorial (Conformal Cooling, How to run a DOE)
  • 3:15 PM                Customer likes and dislikes in current software (Open Discussion)
  • 4:00 PM                Adjourn
Have questions about Moldflow Chicago User Group? Contact Autodesk Simulation Team

When & Where



Embassy Suites
1939 N. Meacham Road
Schaumburg, Il 60173

Thursday, February 20, 2014 from 12:00 PM to 4:00 PM (CST)


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Organizer

Autodesk Simulation Team

The Autodesk® Simulation team offers expertise in Moldflow® (plastic injection molding), Simulation CFD (fluid flow and thermal simulation), and Simulation Mechanical (structural FEA).


Companies worldwide use Autodesk simulation software to help reduce the need for costly physical prototypes, gain a competitive edge through understanding and insight, and bring innovative products to market faster. We provide tools that help:

  • -Validate and optimize the design of plastic parts and injection molds, and study the plastic injection molding process
  • -Develop more comfortable and energy efficient buildings, and develop higher performing products involving flow & thermal phenomena across all  industries (including industrial, medical, consumer and automotive)
  • -Allow engineers to optimize and lightweight components, characterize shock and vibration performance, and complete drop tests digitally before physical prototypes exist


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