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Mold Compound Interactions in Cu-Al Wirebonded ICs Operating in Harsh Environments - Luu Nguyen, TI Fellow

IEEE-Electronics Packaging Society/SCV

Thursday, October 26, 2017 from 11:30 AM to 1:00 PM (PDT)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members-early: Refreshments and Talk
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Oct 25, 2017 $5.00 $1.24
2: non IEEE Members/ late: Refreshments and Talk
Members use this if member category is sold out
Oct 25, 2017 $10.00 $1.49
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Oct 25, 2017 Free $0.00
4: Late/ Walk-in *: IEEE members: Refreshments and Talk
*: on food-available basis. talk-only is free.
Not Started $10.00 $1.49
5: Late/ Walk-in: non IEEE Members: Refreshments and Talk
*: on food-available basis. talk-only is free.
Not Started $15.00 $1.74
6: Sponsorship Oct 26, 2017 $200.00 $10.99

Share Mold Compound Interactions in Cu-Al Wirebonded ICs Operating in Harsh Environments - Luu Nguyen, TI Fellow

Event Details

11:30 AM - 12:00 PM: Check-in / networking - light food
12:00 PM: Presentation
 
Registration [refreshments and talk]:
 
IEEE Members [first 20]:  [also for all students and all unemployed]
  Pre-registration: $  5.00
   [if sold out please use non-IEEE category]
  Walk-in  *:         $10.00     
 
non-IEEE members:
   Pre-registration: $10.00
   Walk-in * :         $15.00
 
*: on a food available basis; talk-only is free any way.
 
[This signs you up for talk too, please do not also register for Talk-Only]

Registration for Talk-Only: FREE
Talk-Only attendees: please check-in by 11:45AM
 

Summary:

For high-reliability applications in harsh environments, better understanding of the acceleration factors under the stresses of operation is required. Prolonged exposure of copper wires at elevated temperatures can result in excessive intermetallic growth and degradation of the bond interface. Mold compounds used for encapsulation can vary widely in their formulations including ionic content, pH, porosity, and diffusion rates. Selection of the right material combination plays a key role in defining the lifetime of the wirebonded system. This talk will discuss the combined effect of various operational parameters such as temperature and bias, along with material properties, in the development of a model to predict the remaining useful life of Cu-wirebonded packages.


Bio:

Dr. Luu Nguyen  is a TI Fellow at Texas Instruments, working on printed electronics, wafer level packaging, high-voltage packaging, and design for manufacturability. He received his Ph.D. in Mechanical Engineering from MIT, and has worked at IBM Research and Philips Research. He coedited two books on packaging, and has over 200 publications. He has over 70 patents and invention disclosures. He is a Fellow of IEEE and ASME, and a Fulbright Scholar (Finland 2002). He received two Best of Conference Awards, one Best Poster of Conference Award, and eight IMAPS and IEMT Best of Session Conference Awards. He received the 2004 IEEE CPMT Outstanding Sustained Technical Contributions Award. Other awards also include the 2003, 2014, 2015, and 2016 Mahboob Khan Outstanding Mentor Award from the Semiconductor Research Corporation in recognition of contributions to student mentoring, research collaboration, and technology transfer. 

CPMT      high reliability, intermetallic growth, bond interface, formulations, temperature, bias, predictive model

Have questions about Mold Compound Interactions in Cu-Al Wirebonded ICs Operating in Harsh Environments - Luu Nguyen, TI Fellow? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95054

Thursday, October 26, 2017 from 11:30 AM to 1:00 PM (PDT)


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Mold Compound Interactions in Cu-Al Wirebonded ICs Operating in Harsh Environments - Luu Nguyen, TI Fellow
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