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Learn how to leverage Cloud CAE to minimize cost, risk, and time-to-market for new MEMS technologies

IEEE SF Bay Area MEMS & Sensors Chapter

Wednesday, September 26, 2018 from 6:30 PM to 8:30 PM (PDT)

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Type End Quantity
IEEE MEMBER Sep 27, 2018 Free  
NON-IEEE MEMBER Sep 27, 2018 Free  

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Event Details

IEEE SF Bay Area MEMS and Sensor Chapter 

Presents

Learn how to leverage Cloud CAE to minimize cost, risk, and time-to-market for new MEMS technologies

Abstract:

The MEMS companies spend hundreds of millions of dollars each year prototyping devices that ultimately fail in the marketplace for various reasons: they did not meet critical customer specs, they arrived too late to the market and were uncompetitive, or they were simply too complex to fully fab, package, and assemble into end-products. Cloud computer-aided engineering (CAE) gives engineers the ability to virtually prototype and analyze many device permutations in parallel, explore massive design spaces, quickly find optimal designs, garner design insights that yield new IP, and, ultimately, drive cost, risk, and time-to-market out of the design cycles for new MEMS devices.  

 Speaker’s Bio:

Ian Campbell is a MEMS and engineering software entrepreneur. Ian began his entrepreneurial career shortly after earning an MS in Aerospace Engineering and MBA from Georgia Tech, when he founded NextInput with his cofounder, Dr. Ryan Diestelhorst. Together, the pair took a new MEMS sensor technology from university level research to smartphone design wins in under four years with less than $20M in VC capital. In 2017, Ian left NextInput to cofound OnScale with an amazing group of numerical scientists, engineers, and software developers. OnScale’s mission is to provide on-demand, scalable Cloud CAE solutions to every engineering team from startups to market-leading enterprises.  

6:30 – 7:00 PM  Networking & Pizza ($5 Donation)

7:00 – 8:00 PM  Invited Talk

8:00 – 8:30 PM  AdCom Meeting

Have questions about Learn how to leverage Cloud CAE to minimize cost, risk, and time-to-market for new MEMS technologies? Contact IEEE SF Bay Area MEMS & Sensors Chapter

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When & Where


Texas Instruments, Inc. Santa Clara Campus
2900 Semiconductor Drive
Building E Conference Center
Santa Clara, CA 95051

Wednesday, September 26, 2018 from 6:30 PM to 8:30 PM (PDT)


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Organizer

IEEE SF Bay Area MEMS & Sensors Chapter

Chapter Goal: The “MEMS and Sensors” chapter provides a forum for networking, learning and exchanging ideas in a welcoming professional environment in the San Francisco Bay Area.

Please visit our website at http://sites.ieee.org/scv-mems/meetings/ for information about the chapter and upcoming meetings.

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