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How to Peel Ultra-Thin Dies from Wafer Tape - Dr. Stefan Behler, Senior Expert Process Engineer, Besi Switzerland AG

IEEE-Electronics Packaging Society/SCV

Thursday, December 7, 2017 from 11:30 AM to 1:00 PM (PST)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members-early: Refreshments and Talk
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
Dec 6, 2017 $5.00 $1.24
2: non IEEE Members/ late: Refreshments and Talk
Members use this if member category is sold out
Dec 6, 2017 $10.00 $1.49
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info Dec 6, 2017 Free $0.00
4: Late/ Walk-in *: IEEE members: Refreshments and Talk
*: on food-available basis. talk-only is free.
Not Started $10.00 $1.49
5: Late/ Walk-in: non IEEE Members: Refreshments and Talk
*: on food-available basis. talk-only is free.
Not Started $15.00 $1.74

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Event Details

11:30 AM - 12:00 PM: Check-in / networking - light food
12:00 PM: Presentation
 
Registration [refreshments and talk]:
 
IEEE Members [first 20]:  [also for all students and all unemployed]
  Pre-registration: $  5.00
   [if sold out please use non-IEEE category]
  Walk-in  *:         $10.00     
 
non-IEEE members:
   Pre-registration: $10.00
   Walk-in * :         $15.00
 
*: on a food available basis; talk-only is free any way.
 
[This signs you up for talk too, please do not also register for Talk-Only]

Registration for Talk-Only: FREE
Talk-Only attendees: please check-in by 11:45AM
 

Summary:

The four major key properties for successful, damage-free ultra-thin die (< 50 um thick) pickup from a wafer foil are described in detail: die bending stress, die strength, edge peel force, and bulk peel force. First, bending stress for different pickup methods (multi stage, multi disc, multi needle) are calculated and compared using a dynamic FEA model. Second, we summarize how the die strength is influenced by die structures and wafer processing steps, especially by thinning and dicing methods. In addition, we present die strength measurements for TSV test dies. Third, the property "wafer foil edge peel force" is introduced, and the dependency on the dicing method is experimentally verified. It clearly shows, that dicing-before-grinding is to be preferred over single cut dicing. Fourth, we give an overview of bulk peel forces of various commercial wafer foils. Values are taken from datasheet specifications, and compared using Kendall’s equation.


Bio:

Stefan Behler  received his M. S. in experimental physics from the University of Göttingen (Gemany) in 1990, and his Ph.D. in physics from the University of Basel (Switzerland) in 1994. He was awarded an Alexander von Humboldt fellowship for a 2-year research project at the Lawrence Berkeley National Laboratory. The project was aimed at the investigation of surface chemistry of noble metals. In 1996 he joined the company Besi (formerly ESEC) focusing on process technology of die bonding. He is currently project manager for ultra-thin die applications at Besi Switzerland. 

CPMT      bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification

Have questions about How to Peel Ultra-Thin Dies from Wafer Tape - Dr. Stefan Behler, Senior Expert Process Engineer, Besi Switzerland AG? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95054

Thursday, December 7, 2017 from 11:30 AM to 1:00 PM (PST)


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