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Heterogeneous Integration Roadmap - 3rd Annual Symposium

IEEE-Electronics Packaging Society/SCV

Thursday, February 20, 2020 at 8:30 AM - Friday, February 21, 2020 at 4:00 PM (PST)

Heterogeneous Integration Roadmap - 3rd Annual...

Registration Information

Registration Type Sales End Price Fee Quantity
Event Sponsor
For Corporate sponsors of this event; please contact organizer from link at bottom of this page for discount code to register additional attendees.
Feb 21, 2020 $1,000.00 $38.19
HIR TWG Members Attending on site
Only for CURRENT members of HIR TWGs who are ATTENDING IN PERSON; IF SOLD OUT and you belong in this category please contact organizer from the link at bottom of this page. If you are CALLING IN please contact Bill Chen.
Feb 21, 2020 Free $0.00
IEEE/ASME members [end 2/10]   more info Feb 10, 2020 $50.00 $3.55
Retired/unemployed/students [end 2/10}] Feb 10, 2020 $25.00 $2.28
General [end 2/10]
Those who are NOT current TWG members **: To become IEEE member please contact organizer
Feb 10, 2020 $60.00 $4.06
IEEE/ ASME Members [end 2/18 @12:30pm]   more info Not Started $60.00 $4.06
Retired/unemployed/ students [end 2/18 @12:30pm] Not Started $35.00 $2.79
General [end 2/18 @12:30pm]
**: To become IEEE member please contact organizer
Not Started $70.00 $4.56
ALL - after 12:30pm Feb 18 and onsite
Please bring screenshot or printout of ticket for check-in; while we will try to, we may not have the time to print your name badges. Food on an if-available basis.
Not Started $100.00 $6.08

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Event Details

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NOTE: No photographs or videos are allowed during the Symposium. (This announcement complies with IEEE policies.)

3rd Annual Heterogeneous Integration Roadmap (HIR) Meeting & Symposium 


Co-hosted by IEEE EPS, EPS Santa Clara Valley Chapter & SEMI


Thursday, February 20, 2020: HIR Symposium


Time: 8:30 AM – 6:00 PM


Who Should Attend: Open to the General Public


Plenary Speakers and Technical Working Group Representatives (from Intel, Google, Boeing, Fraunhofer, NASA, Keysight, Advantest, Cisco, ASE, SEMI, UI, UC, U-Md, UCLA, U-Binghamton, more)


 Friday, February 21, 2020: HIR Technical Working Meeting and Open House


Time: 8:30 AM – 4:00 PM


Who Should Attend: All HIR Technical Working Group members and anyone interested in participating or learning more about the Heterogeneous Integration Roadmap.


The purpose is to provide a structured forum for interaction, collaboration and feedback. 




HIR Annual Meeting & Symposium PURPOSE : We are in a period of technology and market disruptions. There is immense need for pre-competitive technology roadmaps addressing future vision, difficult challenges, and potential solutions.


Heterogeneous Integration will be the key technology direction going forward, for device and subsystem integration. It is the “low hanging fruit” for initiating a new era of technological and scientific advances.   


The 2019 HIR edition was released October 2019. This Annual Meeting kicks off the revision work for the 2020 HIR Edition.   

The Roadmap is freely available to all potential users at no cost. 


3rd HIR Annual Meeting, implementation, cross-TWG integration, participation, work on HIR v2.0 …


Have questions about Heterogeneous Integration Roadmap - 3rd Annual Symposium? Contact IEEE-Electronics Packaging Society/SCV

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When & Where

SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035

Thursday, February 20, 2020 at 8:30 AM - Friday, February 21, 2020 at 4:00 PM (PST)

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