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Heterogeneous Integration Roadmap - 2nd Annual Symposium - Moderators: Dr. William Chen [ASE; Chair HIR) and Dr. Bill Bottoms [3MTS; Co-chair HIR]

IEEE-Electronics Packaging Society/SCV

Thursday, February 21, 2019 at 8:30 AM - Friday, February 22, 2019 at 4:00 PM (PST)

Heterogeneous Integration Roadmap - 2nd Annual...

Registration Information

Registration Type Sales End Price Fee Quantity
Event Sponsor
For Corporate sponsors of this event; please contact organizer from link at bottom of this page for discount code to register additional attendees.
Feb 22, 2019 $1,000.00 $38.19
HIR TWG Current Members
Only for CURRENT members of HIR TWGs; register here if you are ATTENDING IN PERSON. IF SOLD OUT and you belong in this category please contact organizer from the link at bottom of this page.
Feb 22, 2019 Free $0.00
IEEE/ASME members [end 2/10]   more info Feb 10, 2019 $25.00 $2.28
Students/retired/unemployed [end 2/10}] Feb 10, 2019 $25.00 $2.28
General [end 2/10]
Those who are NOT current TWG members **: To become IEEE member please contact organizer
Feb 10, 2019 $40.00 $3.04
IEEE/ ASME Members [end 2/20]   more info Not Started $35.00 $2.79
Students/retired/unemployed [end 2/20] Not Started $35.00 $2.79
General [end 2/20]
**: To become IEEE member please contact organizer
Not Started $50.00 $3.55
Late/ On site - all
Please bring screenshot or printout of ticket for check-in; while we will try to, we may not have the time to print your name badges.
Not Started $75.00 $4.81

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Event Details

Chairs of Working Groups from Intel, Boeing, Fraunhofer, NASA, Infineon, Google, Advantest, StatsChipPaCDow, ASE, ITRISEMI, more

For further information, and latest detailed program updates, schedules etc navigate to

http://www.cpmt.org/scv/?p=818   (or simply www.cpmt.org/scv)

Summary: Heterogeneous Integration will be the key technology direction going forward, for device and subsystem integration. It is the “low hanging fruit” for initiating a new era of technological and scientific advances to continue and complement the progression of Moore’s Law scaling into the distant future. Presentations from HIR Technical Working Group chairs.  

Corporate sponsorships/exhibits available.

Thursday, February 21, 2019: HIR Symposium

Time: 8:30 AM – 6:00 PM

Who Should Attend: Open to the General Public

Speakers: Chairs of Working Groups (from Intel, Boeing, Fraunhofer, NASA, Infineon, Google, Advantest, StatsChipPaC, Dow, ASE, ITRI, SEMI, more

 

Friday, February 22, 2019: HIR Technical Working Meeting and Open House

Time: 8:30 AM – 4:00 PM

Who Should Attend: All HIR Technical Working Group members and anyone interested in participating or learning more about the Heterogeneous Integration Roadmap.

The purpose is to provide a forum for interaction, collaboration and feedback.

Moderators: 

Bio: William (Bill) Chen  currently holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. Bill retired from IBM Corporation after a career spanning over thirty years in various R&D and managerial positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. Bill is the chair of the newly formed Heterogeneous Integration Technology Roadmap for Semiconductors, an initiative addressing technologies for the oT/IoE/cloud computing era, jointly sponsored by IEEE EPS, EDS, Photonics Societies, ASME’s EPPD, and SEMI. He also chairs SEMI’s Advanced Packaging Committee. In 2009, Bill received the InterPACK Excellence Award for his contributions, and in 2010, he was presented with the IEEE EPS Society David Feldman Outstanding Contribution Award. He is a past President of the IEEE EPS Society and he has been elected a Fellow of IEEE and a Fellow of ASME. Bill received his B. Sc. from London University, M.Sc. from Brown University and Ph.D. from Cornell University.

Bio: Dr. W. R. “Bill” Bottoms,  the holder of a Ph.D. from Tulane University, has an extensive background in academia, venture funding, and in the commercial semiconductor equipment sector. Since founding 3MTS in 1999, Bill Bottoms has provided strategic leadership and vision in keeping with the promise of the 3MTS business model. Dr. Bottoms has also served on a number of important government and industry committees and advisory positions. Key posts include chairmanship of the subcommittee of the Technical Advisory Committee of the United States Commerce Department’s Export Control Commission for Semiconductor Equipment and Materials.
Shortly after receiving his doctorate in physics, Dr. Bottoms joined the electrical engineering faculty of Princeton University, where he remained until 1976. He then joined Varian Associates in Palo Alto, as manager of research and development, and he was later named president of Varian’s newly formed semiconductor equipment group. After leaving Varian, he was senior vice president and general partner at Patricof & Co. Ventures, Inc., an international venture capital firm. He founded Third Millennium Test Solutions in March 1999.

 

 

reinvention, disruptive changes, new materials, emerging processes, vision, pace of change 

Have questions about Heterogeneous Integration Roadmap - 2nd Annual Symposium - Moderators: Dr. William Chen [ASE; Chair HIR) and Dr. Bill Bottoms [3MTS; Co-chair HIR]? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035

Thursday, February 21, 2019 at 8:30 AM - Friday, February 22, 2019 at 4:00 PM (PST)


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