After a successful First Edition on 2015, Moroccan Foundation for Advanced Science Innovation and Research (MAScIR), International Microelectronics Assembly and Packaging Society (IMAPS-France) and Electronic, Microelectronic et Mechatronic Cluster of Morocco (CE3M), are pleased to announce the Call for Papers for the 2nd Edition of DeMESys: the International Conference on Development and Manufacturing of Electronic Systems. This conference will be held at Rabat Design Center and will feature 2 days of selected technical presentations focusing on a range of important topics related to the Electronic & Microelectronic systems and their applications.
DeMESys conference is the occasion for attendees involves in the electronic supply chain to present recent researches, exchange about new ideas and solutions, and explore opportunities for the future.
- • Printed Circuit Fabrication and Assembly
- • Power and Automotive Electronics
- • Electronics for Renewable Energy Applications
- • Electronics for Medical Applications
- • Electronics for Smart Agriculture and Environment.
- • Materials for Advanced Packaging
- • Design, Modeling and Simulation
- • 3D Advanced Packaging
- • Sensing Technologies
- • MEMS and Sensors Packaging
- • Reliability and Failure Analysis
- • Solution for Cost Reduction.
Authors are invited to submit papers with original work of not more than 4 pages and minimum of 350 words, in English at pdf format, to email@example.com. All items will be subject to a peer review by the Technical Program Committee. The acceptance criteria are based on the quality, significance and usefulness for the manufacturing world. The guidelines for submission are available on the website of the conference.
A poster session will be devoted to submitted Papers, related to any of the program topics listed above.
Submission Deadline: 30th November 2016
Opening Registration: 30th January 2017
Notification: 21th December 2016
Final Paper: 15th January 2017