San Francisco, California
London, United Kingdom
The Institue of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) and the International Microelectronics and Packaging Society (IMAPS) jointly announce the 2012 Advanced Technology Workshop on Opto-electronic Packaging and Assembly. This workshop will feature an ITRS Assembly and Packaging Roadmap working session as well.
Optoelectronic Packaging & Assembly
Thursday, September 6, 2012, 8:00 am – 5:00 pm
Invited technical experts will be presenting on the advances and trends in the Optoelectronic Packaging and Assembly Technology areas for applications such as Optical Interconnects & Semiconductor Photonics, Optical Transceivers & Networks, High Brightness LED and CMOS Image Sensors.
Keynote Address: Prof. Ricky Lee, President, IEEE CPMT Society
Dr. Mehdi Asghari, Kotura, Dr. Daniel Van Blerkom, Forza Silicon, Ron Bonne, Philips Lumileds, Dr. Jack Cunningham, Oracle Labs, Dr. Peter De Dobbelaere, Luxtera, Dr. Ali Ghiasi, Broadcom, Dr. Radha Nagarajan, Infinera, Dr. AditNarasimha, Molex, Prof. George Papen, UCSD, Dr. Mark Verdiell, Samtec, and more...
ITRS Assembly & Packaging Roadmap Working Session
Friday, September 7, 2012, 8:00 am – 12:00 pm
The International Technology Roadmap for Semiconductors (ITRS) Organization will hold an assembly and packaging roadmap working session for the workshop participants, with a presentation on the ITRS working process and an interactive discussion about their optoelectronic packaging activities.
Note: Early bird prices extended to August 17th, 2012! Prices increase by $50 afterwards.