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Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation - Rozalia Beica ­ DuPont, Global Director Strategic Marketing, Electronics & Imaging Division

IEEE-Electronics Packaging Society/SCV

Friday, June 28, 2019 from 11:30 AM to 1:00 PM (PDT)

Registration Information

Registration Type Sales End Price Fee Quantity
1: IEEE members
Please enter active IEEE membership number when asked during registration. If student enter STUDENT in member number field, or unemployed enter UNEMPLOY or RETIRE. If sold out please use non-member category.
2d 17h 28m $5.00 $1.27
2: non IEEE Members
Members: use this if member category is sold out
2d 17h 28m $10.00 $1.53
3: Talk Only - (Please arrive by 11:45am) [IEEE members: please enter membership info when prompted]   more info 2d 17h 28m Free $0.00
4: Late*: IEEE members
* Online reg starts at 12 noon day-before event.
Not Started $10.00 $1.53
5: Late*: non IEEE Members
* Online reg starts at 12 noon day-before event.
Not Started $15.00 $1.78
6: Late: Talk-only ((Please arrive by 11:45am) [IEEE members: please enter membership info when prompted] Not Started Free $0.00

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Event Details

11:30 AM - 12:00 PM: Check-in / networking - FOOD [PIZZA]
12:00 PM: Presentations
 
PLEASE NOTE: this is a FRIDAY event.
 
Registration [refreshments and talk]:
 
IEEE Members:   [also for all students and all unemployed] : $  5.00
   [if sold out please use non-MEMBER category]
 
non-IEEE members: $10.00 
 
WE USUALLY GET PRESENTER SLIDE DECK, but sometimes not. When speaker provides it, in original or sanitized form, it will be uploaded at the chapter website - cpmt.org/scv.  Older presentation may also be accessed. 

Summary:

Digital transformation is further expanding into new markets bringing new application opportunities and driving increased adoption of electronics and semiconductor devices. The explosion of new applications is driving the semiconductor industry to transition from a technology node to an application driven industry. While advancing the technology node continues, new architectures and integration technologies are being developed to address increasing market requirements and the need of integrating more functionalities within smaller and more compact systems. A wide range of packaging technologies have already been successfully developed and adopted in the industry enabling single and multi-die packaging. While these technologies will continue to grow and further evolve, heterogeneous integration is gaining a lot of interest in the industry due to several benefits it can bring. This will also drive the need for more performing electronic materials and processes.

 

The presentation will provide an overview of the major trends (5G, Artificial Intelligence, IoT, Autonomous Driving, etc.) driving the semiconductor and packaging industry. The talk will highlight the various packaging platforms and their evolution as well as the material and processing challenges and needs driven by these applications.

Bio:

Rozalia Beica is Global Director Strategic Marketing, DuPont, Electronics & Imaging Division.

 

In her current role, Rozalia leads strategic marketing activities across Electronics & Imaging Division. She has 27 years of international working experience across various industries, including industrial, electronics and semiconductors. For 20 years she was involved in the research, applications and strategic marketing of Advanced Packaging technologies, with global leading responsibilities at specialty chemicals (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials and Lam Research) and device manufacturing (Maxim IC). Prior to joining DuPont, Rozalia was the CTO of Yole Développement where she led the market research, technology and strategy consulting activities for Advanced Packaging and Semiconductor Manufacturing.

 

Throughout her career, Rozalia has been actively supporting industry activities worldwide: Program Director of EMC3D Consortia, General Chair of IMAPS Device Packaging and Global Semiconductor and Electronics Forums, Technical Advisory Board Member at SRC, Member of the Executive Committee of ECTC, IMAPS SiP, ISQED, ESTC and member of several committees worldwide (ITRS, IWLPC, EPTC and EPS). Current industry involvements include: IMAPS VP of Technology, Technical Chair IMAPS Advanced SiP USA and SiP China Symposium, ECTC Assistant Program Chair, HIR WLP Chair, Advisory Board Member of 3DinCites and IMPACT Taiwan.  She has over 150 presentations and publications (including 3 book chapters on 3D IC technologies), several keynotes, invited presentations and panel participations.

 

Rozalia has a M.Sc. in Chemical Engineering from Polytechnic University "Traian Vuia" (Romania), a M.Sc. in Management of Technology from KW University (USA), and a Global Executive MBA from Instituto de Empresa Business School (Spain).

 

Digital transformation, packaging technologies, multi-die packaging, heterogeneous integration, 5G, Artificial Intelligence, IoT, Autonomous Driving,

Have questions about Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation - Rozalia Beica ­ DuPont, Global Director Strategic Marketing, Electronics & Imaging Division? Contact IEEE-Electronics Packaging Society/SCV

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When & Where


SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, CA 95035

Friday, June 28, 2019 from 11:30 AM to 1:00 PM (PDT)


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