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31st Annual Electronics Packaging Symposium- Small Systems Integration

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GE Research

1 Research Circle

Niskayuna, NY 12309

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GE Research and IEEC-Binghamton University are proud to host the 31st Annual Electronics Packaging Symposium- Small Systems Integration.

About this Event

GE Research and IEEC-Binghamton Univerisity invite you to join us for this two-day event on September 5 and 6, 2019 at GE Research Center in Niskayuna, NY.

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:

  • 2.5/3D Packaging
  • mm Wave in Packaging
  • Automotive & Harsh Environments
  • Bioelectronics
  • Flexible & Additive Electronics
  • Materials for Packaging & Energy Storage
  • MEMS
  • Photonics
  • Power Electronics
  • Sensors, Embedded Electronics & IoT
  • Thermal Challenges
  • Wearable and Flexible Electronics for Medical Applications

This year's program includes keynote speakers, 12 sessions with technical presentations, a half-day IEEE EPS Heterogeneous Integration Roadmap Workshop on September 6, a student poster session with students from local Universities in NY, and exhibits from leading companies.

We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share ones expertise, learn, and build partnerships.

Who should attend: All are welcome

  • Attendees range from those who are simply curious and wish to understand the topics related to electronics packaging and it's network of applications.
  • Companies, startups to leading companies, seeking to either share or better understand technical aspects that are applicable to the field, their products, or future products.

LEARN what you need to SEEK. Find people with the right SERVICES.

  • Researchers looking to share their work or connect to industry members for current or future projects.
  • Sponsors and exhibitors wishing to showcase their new products and services to a diverse audience.
  • Students who wish to present their research to receive valuable input from experienced academic, industry and government members, and find opportunities for potential collaborations.

CONNECT. You never know who you will end up meeting. SHOW UP. You never know what opportunities will come your way.

Last year our symposium successfully consisted of 380+ attendees, 52 invited speakers,12 technical sessions, 54 student posters and 53 exhibits. We look forward to another year filled with knowledge-sharing opportunities.

Visit our website for registration details and program updates:

https://www.binghamton.edu/ieec/2019eps/

Contact us at: epsympos@binghamton.edu

REGISTER TODAY and join a community which seeks advancement in the electronics packaging field.

We look forward to seeing you this fall.

Sincerely,

2019 EPS Team

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GE Research

1 Research Circle

Niskayuna, NY 12309

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