Wednesday, August 19, 2009 at 1:00 PM - Friday, August 21, 2009 at 4:00 PM (ET)
Length: 3 Days
Price: $1800.00
Prerequisite: Introduction to ANSYS or Introduction to ANSYS for MEMS
The course focuses on coupled physics simulation methods and techniques for common MEMS devices, such as:
· thermal-electric actuators
· comb drive resonators
· micromirrors
· switches and piezoelectric actuators.
Advanced technical concepts covered include:
· electrostatics
· capacitance extration
· piezoelectrics
· pre-stress effects
· initial stress effects
· damping characterization via CFD simulation
· thermal-electric coupled simulation
· coupled electrostatic-structural dynamic simulation including time-harmonic and time-transients
· substructuring
· reduced order modeling using coupled transducer elements
· pull-in and hystersis simulation and more.
Course Topics Include:
· Geometric Nonlinearities and Initial Stress Contact Analysis for MEMS Applications Pre-Stressed Modal Analysis Beam Cross-Section Modeling
· Introduction to Electrostatic Analysis Capacitance
· Hybrid Trefftz-Finite Element Method for Open Domains
· Electrostatic-Structural Coupling Fundamentals Sequential Method for Electrostatic-Structural Coupling
· Direct Matrix-Coupled Electrostatic-Structural Methods using the TRANS126 Transducer
· Pre-Stressed Modal and Pre-Stressed Harmonic Analysis using TRANS126
· Large-Signal Transient Analysis using TRANS126
· Reduced Order Macro Modeling for System Simulation of MEMS Devices Introduction to Piezoelectric Analysis
· Introduction to Current Conduction Analysis Thermal-Electric Coupled-Field Analysis
· Thermal Stress Analysis
· Using CFD for Reduced Order Modeling Damping Characterization
· Units System for MEMS Simulation
Each course chapter is followed by "hands-on" workshops and exercises.
Wednesday, August 19, 2009 at 1:00 PM
- to -
Friday, August 21, 2009 at 4:00 PM (ET)
Other Maps:
Via MichelinSimuTech Group, Inc. is the largest reseller of ANSYS engineering simulation software in North America. To complement sales and support of this technology, the company provides training, mentoring, consulting and testing services. With more than 60 employees, over 50 percent of staff hold advanced degrees in fields such as engineering and sciences; many also have extensive industry expertise, including the aerospace, turbomachinery, automotive, electronics packaging and medical industries. Headquartered in Rochester, New York, U.S.A., the company has eight offices in North America
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