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San Francisco, California
London, United Kingdom
Refreshments at 6:00 with the presentation begining at 6:30
Yasser Hussein will present a talk on “Advanced EDA tools for Multi-Radio High Frequency Accurate IC Design”
As many devices, such as smart cell phones, now have RF connections with a variety of small antennas we will get an update on EDA tools that influence the design of the RF circuits that connect to the antennas
Advances in technology have enabled the possibilities to integrate multi-band and multi-mode radios into single packaged chips covering the diversity of communication standards from 2G GSM, 3G UMTS, to 4G LTE and LTE-advanced as well as WLAN, BT, and GPS impart unique challenges on the RF CAD/EDA due to the high complexity and integration of such chips. Existing EDA tools to model/simulate RF-chip performance, model the active and passive components separately. Subsequently, the designer uses simple calculations (or co-simulation) to approximate the performance of the overall RF design. Such calculations or methodologies were somewhat effective in the past but result in grossly inaccurate results for today’s complex chips. The consequence is excessive design cycles (typically 3 to 4), high costs and ultimately lost time-to-market opportunities. For today’s complex chips, a designer needs to simulation the IC package as a whole to include electromagnetic coupling, interference, and radiation.
The focus in this talk will be on the challenges and requirements as well as the latest trends on multi-radio EDA. Detailed overview and comparison will be provided of today EDA tools with emphasis on PedaSoft’s tools. Design challenges and examples will be given including PA design, switch design, and integrated antenna switch module design.
Dr. Yasser Hussein received his Ph.D. in Electrical Engineering from Arizona State University, Tempe, AZ in 2003. From 2003 to 2006, he was a Member of Research Staff at Stanford University’s SLAC. During the Spring of 2005, he was a Lecturer with the Electrical Engineering Department, Stanford University, where he developed and lectured a new course concerning advances in RF modeling and design. From 2005 to 2007, he led the RF design team and was the principle technical contributor for Intel’s Wireless Laminate Module (WLM) technology and product development that integrated the radio, including the power amplifier, and the base band in a single packaged laminate module for the first time at Intel. In 2007, he joined PedaSoft, a start-up company, where he is now the Chief Technology Officer. Dr. Hussein is an IEEE Senior Member and a member of several IEEE Societies.