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IEEE CPMT OC Chapter Tutorial - Advance Package Failure Analysis Methods

IEEE CPMT OC Chapter

Tuesday, August 19, 2014 from 5:00 PM to 7:30 PM (PDT)

Ticket Information

Ticket Type Remaining Sales End Price Fee Quantity
IEEE member 42 Tickets Ended $10.00 $1.24
Non-IEEE member 47 Tickets Ended $20.00 $1.49
Student non-IEEE member 45 Tickets Ended $5.00 $1.12
Student IEEE member 47 Tickets Ended Free $0.00

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Event Details

OVERVIEW:

This tutorial will provide an overview of the Failure Analysis process as it relates to electronic packaging. Attendees will learn about:

  • The FA methodology and flow
  • The importance of a failure’s background history
  • Destructive and non-destructive analytical steps including decapsulation and CSAM
  • Electrical and physical FA; e.g. curve tracing, cross-section, and SEM
  • Advanced techniques: TDR, SQUID and 3D X-ray

 

WHO SHOULD ATTEND:

IC Packaging Design / Development / Reliability engineers, Chip Design Engineers and Managers who would like to learn about Failure Analysis techniques to understand Semiconductor Chip / Package Failure Modes

 

ABOUT THE INSTRUCTOR:
Winfield Scott is the Director of Technology at Evans Analytical Group and has the responsibility to ensure EAG has the tools and techniques to keep up with the advances in semiconductors and electronic packaging. He has been using FA to help solve problems for over 40 years. In addition to EAG, he has worked for Motorola, Western Digital, and Sperry Flight Systems.


Date:                      Tuesday, August 19th, 2014                                                                              

 

 Location:               Broadcom Corporation. 5300 California Ave, Irvine, CA 92617

                                Bldg. 2 – 1st Floor Conference Room – Salt Creek

 Time:                      5:00pm: Registration, 5:30pm – 7:30pm: Short Course, 7:30pm - Dinner

Registration Fee:  IEEE members - $10;

Non-members of IEEE - $20;

Student IEEE members - FREE;

Student Non-IEEE Members - $5 (includes Dinner & Training material)

Have questions about IEEE CPMT OC Chapter Tutorial - Advance Package Failure Analysis Methods? Contact IEEE CPMT OC Chapter

When & Where


Broadcom Corporation
5300 California Ave
Bldg. 2 – 1st Floor Conference Room – Salt Creek
Irvine, CA 92617

Tuesday, August 19, 2014 from 5:00 PM to 7:30 PM (PDT)


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Organizer

IEEE CPMT OC Chapter

IEEE CPMT OC Chapter

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