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15th IEEE Int'l Symposium and Exhibition on Advanced Packaging Materials

IEEE CPMT OC Chapter

Wednesday, February 27, 2013 at 8:00 AM - Friday, March 1, 2013 at 12:00 PM (PST)

15th IEEE Int'l Symposium and Exhibition on Advanced...

Ticket Information

Ticket Type Sales End Price Fee Quantity
Member Ended $250.00 $0.00
Non-Member Ended $300.00 $0.00
Student Member Ended $175.00 $0.00
Student Non-Member Ended $200.00 $0.00

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Event Details

The Institute of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) announces the 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials to be held at Atrium Hotel in Irvine, California from February 27th to March 1st, 2013.


Focus Area - Abstracts are solicited in the following areas:

  • Adhesives and underfills - materials & applications, advanced processes, and reliability
  • Circuit boards, substrates, and dielectrics - advanced circuit boards and substrates, properties, and processing
  • Encapsulants, thin films, and coatings - materials & applications, new processes, and reliability
  • Flip-chip interconnect materials and processing - bumping materials, bumping methods, and reliability evaluations
  • Materials and processes for 3-D integration - thru-silicon-via formation, stacking, plating and bonding
  • Optoelectronic and microwave materials - New materials and processes for optoelectronic and microwave packaging
  • Solders and soldering operations - lead-free solders, new bonding and soldering processes, reliability
Have questions about 15th IEEE Int'l Symposium and Exhibition on Advanced Packaging Materials? Contact IEEE CPMT OC Chapter

When & Where


Atrium Hotel
18700 MacArthur Blvd
Irvine, CA 92612

Wednesday, February 27, 2013 at 8:00 AM - Friday, March 1, 2013 at 12:00 PM (PST)


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15th IEEE Int'l Symposium and Exhibition on Advanced Packaging Materials
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